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IC Process Micro-Electro-Mechanical-Systems (MEMS) is a rapidly growing field that is built on the existing silicon processing infrastructure to create micron-scale machines. In the last two decades, MEMS technology has brought us many exciting commercial products, such as accelerometers used in the air bags, digital micromirror devices for image displays, optical switches, micro pumps, and biosensors. Most of these miniature sensors or actuators are manufactured by using the silicon micromachining facilities. Beyond the conventional integrated circuits, these on-chip integrated MEMS devices will combine the functions of sensing, computing, actuation, control, communication and power together on a single chip. We are targeting at some novel MEMS devices. We have full access to the nano- and micro-machining facilities at UC Berkeley Microlab, with which we can perform planarization, chemical procedure, lithography, etching, metallization, dielectric deposition and characterization, etc. processes. In addition, we can utilize a non-conventional Micro-fabrication method, Microstereolithography (mSL), to fabricate unique three-dimensional polymer based micro-devices. Other facilities in our group, such as FIB, AFM, SEM and FTIR, give us ability to step forward from MEMS fabrication to Nano-Electro-Mechanical-System (NEMS) fabrication and characterization. 
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